Infinix majorly focuses on medium-range smartphones, although it's not a big player in the smartphone industry but lately, its brought some fascinating technology to the fore. One such tech is 3D Vapor Cloud Chamber technology- aimed at reducing the temperature of the device and thereby improving performance.
According to the maker, in comparison to previous designs, its 3D Vapour Cloud Chamber Tech decreases the temperature of the chipset by 3 °C. The company’s tech advances the contact between the vapor chamber and the chipset. The Phone voice channels are generally flat. It requires the use of the thermal paste between the chipset and the Vapor Chamber. The 3D VCC design has a “bump”. It leaves just a small gap between the chamber and the chipset. Interestingly, the bump increases the internal volume of the VC. Therefore it can hold more water.
Although such a design comes with its own barrage of challenges, the vapour chamber in it is a passive element and therefore it requires a wicking material to transfer condensed water from the cool area to the hot area of the phone.